Factory

Production Floor : 20,000 sq.ft

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SMT Machine Capability

PCB Board Size:
Min. (L)50 x (W) 50 x (t) 0.4 mm
Max. (L) 680 x (W) 460 x (t) 5.0 mm
ConnectorPitch : 0.3 mm
Chip size: Min. 0402 mm
IC Package : QFP/CSP/FPBGA 0.3 mm
SMT Capacity : 200M / points/month

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Inspection Equipment

3D Solder Paste Inspection (SPI-2000)
AOI Inspection (Hurricane / Saki)
X-Ray Inspection (SMX-1000)
ROHS XRF Analyzer (EDX-720)
In-circuit Test (Focus-2000)

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